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G06600 - SEMI G66 - 半導体用プラスチックモールディングコンパウンドの吸湿特性の測定方法 Revision:SEMI G66-96 (Reapproved 0811) - Superseded SEMI M8-93 (technical revision)
G06600 - SEMI G66 - 半導体用プラスチックモールディングコンパウンドの吸湿特性の測定方法 Revision:SEMI G66-96 (Reapproved 0811) - Superseded SEMI M8-93 (technical revision)
$115.50
Description
SEMI M8-93 (technical revision)
SEMI M56-1018 (Reapproved 1023)
used to ship
The dynamic test method evaluates performance during component operation and provides an indication of the steady state particle contribution due to dynamic operating conditions
G06600 - SEMI G66 - 半導体用プラスチックモールディングコンパウンドの吸湿特性の測定方法 Revision:SEMI G66-96 (Reapproved 0811) - Superseded SEMI M8-93 (technical revision)global Assembly & Packaging Technical Committee201171global Audits and Reviews Subcommittee20118www. semiviews. org www. semi. org1996200411 : Referenced SEMI Standards None.
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 - Superseded SEMI M8-93 (technical revision)){kind=link}