Corning EAGLE XG wafer 76.2mm dia x 0.5mm, 2 sp surface quality 60/40 - CorningEagle76D05C2opt Thermocouples Use the MSK-118A folding machine

Use the MSK-118A folding machine to partially fold the edge

Pressing Rod Diameter: 14

Single-point setting controller

Compared with CdTe

Corning EAGLE XG wafer 76.2mm dia x 0.5mm, 2 sp surface quality 60/40 - CorningEagle76D05C2opt Thermocouples Use the MSK-118A folding machineFeatures: Corning EAGLE XG Glass Substrates Suggested Max. Use Temperature: 675 deg C (1,247 deg F ) Dimension: 76. 2 mm (+ 0. 2mm) x 0. 5 mm(+ 0. 05mm) High transmission (75 80 %) Low defect densities Low ohmic values Surface Quality; 60 40 Edge : CNC ground Non effective area: 2. 0mm Border Highly transparent LCD and OLED applications For the properties of Corning EAGLE XG Glass,please click here. For the Data of BOROFLOAT Borosilicate Float