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Semiconductor devices. Mechanical and climatic test methods - Flammability of plastic-encapsulated devices (internally induced) Ingestion-build-48974 EN 16232:2013
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Description
EN 16232:2013
PD 6696-2: 2007 does not cover the detailing of components for seismic design or the design of parapets
Type 4 is known as a turned finish
Type LSH-PC simplex terminated on IEC 60793-2-50 category B1
Semiconductor devices. Mechanical and climatic test methods - Flammability of plastic-encapsulated devices (internally induced) Ingestion-build-48974 EN 16232:2013What is BS EN 60749 31 Plastic encapsulated devices about? BS EN 60749 31 is an international standard that focuses on mechanical and climatic test methods for semiconductor devices. BS EN 60749 31 establishes mechanical and climatic test methods for semiconductor devices with memory when subjected to energetic particles such as alpha radiation. It can be applied to any type of integrated circuit with a memory device. Note: BS EN 60749 31 is identical
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