Semiconductor devices. Micro-electromechanical devices - Test method of bonding strength between PDMS and glass Ingestion-build-48183 BS EN ISO 3506‑2 specifies

BS EN ISO 3506‑2 specifies the mechanical and physical properties of nuts

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Semiconductor devices. Micro-electromechanical devices - Test method of bonding strength between PDMS and glass Ingestion-build-48183 BS EN ISO 3506‑2 specifies1 Scope This part of IEC 62047 describes test method for bonding strength between poly dimethyl siloxane (PDMS) and glass. Silicone based rubber, PDMS, is used for building of chip based microfluidic devices fabricated using lithography and replica moulding processes. The problem of bonding strength is mainly for high pressure applications as in the case of certain peristaltic pump designs where an off chip compressed air supply is used to drive the